In this paper, we fabricated an Al/new fuchsin/p-Si organic-inorganic (OI) Schottky diode structure by direct evaporation of an organic compound solution on a p-Si semiconductor wafer. A direct optical band gap energy value of the new fuchsin organic film on a glass substrate was obtained as 1.95 eV. Current-voltage (I-V) and capacitance-voltage (C-V) measurements of the OI device were carried out at room temperature. From the I-V characteristics, it was seen that the Al/new fuchsin/ p-Si contacts showed good rectifying behavior. An ideality factor value of 1.47 and a barrier height (BH) value of 0.75 eV for the Al/new fuchsin/ p-Si contact were determined from the forward bias I-V characteristics. A barrier height value of 0.78 eV was obtained from the capacitance-voltage (C-V) characteristics. It has been seen that the BH value of 0.75 eV obtained for the Al/new fuchsin/ p-Si contact is significantly larger than that of conventional Al/p-Si Schottky metal-semiconductor (MS) diodes. Thus, modification of the interfacial potential barrier for Al/p-Si diodes has been achieved using a thin interlayer of the new fuchsin organic semiconductor; this has been ascribed to the fact that the new fuchsin interlayer increases the effective barrier height because of the interface dipole induced by passivation of the organic layer.