A potential Cu/V-organophosphonate platform for tailored void spaces via terpyridine mold casting


Bulut A., Worle M., ZORLU Y., KİRPİ E., KURT H. , Zubieta J., ...Daha Fazla

ACTA CRYSTALLOGRAPHICA SECTION B-STRUCTURAL SCIENCE CRYSTAL ENGINEERING AND MATERIALS, cilt.73, ss.296-303, 2017 (SCI İndekslerine Giren Dergi) identifier

  • Cilt numarası: 73
  • Basım Tarihi: 2017
  • Doi Numarası: 10.1107/s2052520617000245
  • Dergi Adı: ACTA CRYSTALLOGRAPHICA SECTION B-STRUCTURAL SCIENCE CRYSTAL ENGINEERING AND MATERIALS
  • Sayfa Sayıları: ss.296-303

Özet

The reaction of appropriate copper and vanadium salts with tetratopic methane tetra-p-phenylphosphonic acid (MTPPA) in the presence of 2,2':6':2 ''-terpyridine (terpy) yielded the three-dimensional bimetallic copper vanadium phosphonate framework [{Cu(terpy)}(4)Cu(VO2)(4)(MTPPA-H)(2)]center dot 4H(2)O (1). Terpy has no net contribution to the three-dimensional structure providing a potential platform for void space formation via mold-casting. The structure was characterized by single-crystal X-ray diffraction and thermogravimetric analysis (TGA). Magnetic measurements were performed using a SQUID magnetometer. The crystal structure of the methanol solvate of the free ligand, MTPPA center dot MeOH, was analysed using Hirshfeld surfaces and fingerprint plots.